Chip Packaging News

Latest Articles

• NIST Physicists Engineer Robust Inorganic Bonding Technique for Photonic Chips Operating in Extreme Aerospace and Cryogenic Environments

  Published: Mar 31, 2026

  Section: Research

  Researchers at the National Institute of Standards and Technology have developed a glasslike chemical bonding method to replace fragile organic glues in photonic integrated circuit...

• India Achieves Technological Milestone with Opening of First Domestic Semiconductor Assembly Facility

  Published: Feb 28, 2026

  Section: Asia

  In a significant stride toward global electronics self-reliance, India has officially opened its first semiconductor assembly and testing facility. The plant, located in Gujarat, m...