Broadcom Targets Billion-Dollar Revenue Stream with 1 Million 3D-Stacked AI Chips by 2027

Broadcom expects to sell 1 million 3D-stacked AI chips by 2027, leveraging a new design with Fujitsu and TSMC to rival Nvidia and AMD.

By: AXL Media

Published: Feb 26, 2026, 9:27 AM EST

Source: The information in this article was sourced from Reuters and CNA

A Vertical Leap in Chip Design

Broadcom is pivoting toward a "stacked" future to solve the massive power and speed requirements of modern artificial intelligence. The company’s 3D-stacking technology allows two distinct pieces of silicon to be bound tightly on top of one another. This vertical integration slashes the distance data must travel between components, resulting in higher "horsepower" and lower energy consumption. Harish Bharadwaj, Broadcom’s VP of product marketing, noted that the 1 million unit forecast represents a multi-billion dollar opportunity as the tech moves from experimental phases to mass adoption.

Fujitsu and the 2-Nanometer Frontier

The first commercial application of this technology will see Fujitsu utilize Broadcom’s designs for its next-generation data center chips. These chips are being fabricated by Taiwan Semiconductor Manufacturing Co (TSMC), using a cutting-edge hybrid approach that fuses a 2-nanometer chip with a 5-nanometer chip during the manufacturing process. Engineering samples are currently being tested, with full production slated for the second half of 2026. This "mix and match" capability allows customers to optimize performance and cost by using different manufacturing nodes for each layer of the stack.

Expanding the Custom Silicon Portfolio

Broadcom’s success is largely built on its role as a high-end translator for tech giants like Google and OpenAI. While Broadcom doesn't always design the logic of the chip, its engineers turn concepts like Google's Tensor Processing Units (TPUs) into physical layouts ready for fabrication. The company expects its AI chip revenue to double to $8.2 billion in the first fiscal quarter of 2026 alone. The new stacking technology is already being adopted by "pretty much all" of Broadcom’s current custom silicon customers.